Applications of Tire Chips

Humphrey, D.N., and Eaton, R.A. (1995), “Field Performance of Tire Chips as Subgrade Insulation for Rural Roads,” Proceedings of the Sixth International Conference on Low-Volume Roads, Transportation Research Board, Washington, D.C., Vol. 2, pp. 77-86.

Cosgrove, T.A. (1995), “Interface Strength Between Tire Chips and Geomembrane for Use as a Drainage Layer in a Landfill Cover,” Geosynthetics’95, Industrial Fabrics Association, St. Paul, Minnesota, Vol. 3, pp. 1157-1168.

Humphrey, D.N., and Eaton, R.A. (1994), “Performance of Tire Chips as an Insulating Layer Beneath Gravel Surface Roads,” Proceedings of the Fourth International Symposium on Cold Region Development, Espoo, Finland, pp. 125-126.

Humphrey, D.N., and Nickels, W.L., Jr. (1994), “Tire Chips as Subgrade Insulation and Lightweight Fill,” Proceedings of the 18th Annual Meeting of the Asphalt Recycling and Reclaiming Association, Asphalt Recycling and Reclaiming Association, Annapolis, Maryland, pp. 83-105.

Gharegrat, H. (1993), “Finite Element Analyses of Pavements Underlain by a Tire Chip Layer and of Retaining Walls with Tire Chip Backfill,” M.S. Thesis, Department of Civil Engineering, University of Maine, Orono, Maine, 222 pages.

Humphrey, D.N., and Sandford, T.C. (1993), “Tire Chips as Lightweight Subgrade Fill and Retaining Wall Backfill,”i, Denver, Colorado, pp. 5-87 to 5-99.

Humphrey, D.N., and Eaton, R.A. (1993), “Tire Chips as Subgrade Insulation – Field Trial,” Proceedings of the Symposium on Recovery and Effective Reuse of Discarded Materials and By-Products for Construction of Highway Facilities, Federal Highway Administration, Denver, Colorado, pp. 5-55 to 5-68.

Humphrey, D.N., and Eaton, R.A. (1993), “Tire Chips as Insulation Beneath Gravel Surfaced Roads,” Proceedings of the International Symposium on Frost in Geotechnical Engineering, Anchorage, Alaska, A.A. Balkema Publishers, Rotterdam, Netherlands, pp. 137-149.

Humphrey, D.N., Sandford, T.C., Cribbs, M.M., and Manion, W.P. (1993), “Shear Strength and Compressibility of Tire Chips for Use as Retaining Wall Backfill,” Transportation Research Record No. 1422, Transportation Research Board, Washington, D.C., pp. 29-35.

Humphrey, D.N. and Manion, W.P. (1992), “Properties of Tire Chips for Lightweight Fill,” Proceedings of Grouting, Soil Improvement, and Geosynthetics, New Orleans, Louisiana, Vol. 2, pp. 1344-1355.

Humphrey, D.N., Sandford, T.C., Cribbs, M.M., Gharegrat, H.G., and Manion, W.P. (1992), “Tire Chips as Lightweight Backfill for Retaining Walls – Phase I,” A Study for the New England Transportation Consortium, Department of Civil Engineering, University of Maine, Orono, Maine, 137 pp. + appendices.

Manion, W.P., and Humphrey, D.N. (1992), “Use of Tire Chips as Lightweight and Conventional Embankment Fill, Phase I – Laboratory,” Technical Paper 91-1, Technical Services Division, Maine Department of Transportation, Augusta, Maine, 151 pp. + appendices.